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Latest News
• Dongguan Chang An QPL Electronics Factory
upgraded to
ISO14001:2004 certification on November 25, 2011
• Dongguan Chang An QPL Electronics Factory upgraded to ISO/TS16949:2009 on July 05,2010
• QPL Limited is awarded " Supplier Excellence Award 2009 " by PT-Unisem
• Dongguan Chang An QPL Electronics Factory renewed ISO16949/9001 certification on May 15, 2009
• QPL Limited obtained United States Patent for "Selective NiPdAu Plated Leadframe" on March 2009.
• Dongguan Chang An QPL Electronics Factory has achieved IECQ HSPM QC080000 certification on January 12, 2009
• Dongguan Chang An QPL Electronics Factory renewed ISO14001:2004 certification on November 28, 2008
•
Appointment of Rydon Technology Limited as exclusive Sales Agent for QPL limited in Europe
• From March 21st until March 23th QPL successfully displayed our products at the Semicon China Fair in Shanghai. Many visitors showed genuine interest in our goods. For the company members unable to attend the fair,we have attached photographs taken during the exhibition, these are now on our company website.
• QPL will participate in SEMICON China 2007, which will be held in Shanghai New International Expo Center during Mar 21 to Mar 23, 2007. Please visit our booth# 3547.
• Award of China Environmental Friendly Enterprises
• Hana Ayutthaya Supplier Appreciation Ceremony, Nov 27, 2006
• Appointment of Willie Morrison as President of QPL (US) Inc.
•
QPL Limited has been assessed and certified TS16949 / ISO9001 by SGS.
• Semicon Singapore 2006 Exhibition Photos.
• Semicon Shanghai 2006 Exhibition Photos.
• QPL ChangAn Factory has been assessed and certified ISO 14001: 2004 version by SGS
• SGS Recommendation Letter to DongGuan Changan QPL Electronics Factory for ISO14001:2004 Certification.
• Dongguan Chang An QPL Electronics Factory is certificated for ISO14001:2004 on Nov 8, 2005.
• QPL received BEST SUPPLIER AWARD (2003 TO 2004) from VISHAY Semiconductor
• Semicon Shanghai 2005 Exhibition Photos.
• QPL obtains United States Patents for its process for enhancement of adhesion properties for copper based leadframe applications.
Last updated on 29 Nov, 2011
