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Brief Introduction:
The Plactic Dual In-line Package/Shrink Plastic Dual In-line Package has a rectangular plastic body with two rows of leads that are bent up from the package body at a slight angle. Its most common use is through-hole insertion mounting in applications such as logic, processor and memory devices. QPL also delivers IDF(Interdigitated Frame) versions that enable more lead frames to be oriented along a strip, resulting in increased throughput in assembly.