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Brief Introduction:
The High Density Leadframe (HDL) is the latest innovation in the QFN (Quad Flat No-Lead ) packaging evolution that delivers the greatest number of leads per body size while delivering the highest performance at a lower cost. The HDL package and processes were invented and developed by Mr. Li Tung Lok (TL Li) of QPL Limited and uses high density leadframe routing to allow contacts to cover the total bottom area of the package.The HDL’s unique two-step LF etching process allows the package to be designed around the die and application and results in the shortest wire bond lengths of any wire bonded technology. With outstanding electrical, thermal, and MSL level 1 performance, the HDL package is ideal for single die, MCM and SIP applications using either Flip Chip and/or Wire Bonding connections. The IC Packaging Technology of the future is here today with HDL solutions.