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Brief Introduction:
The Quad Flat Non-Lead package type delivers the small footprint and low pin count needed for today’s portable devices and high-speed application demanding high electrical performance in a constrained area. QFNs are miniaturized, low pin-count, perimeter-array package that use a metallic lead frame for the die assembly and board interconnection. This design allows the use of standard die-attach, wire-bond and encapsulation technologies and equipment. QFN is a lead frame-base CSP (Chip Scale Package) type of package with a "leadless" element that enables superior thermal performance and the ability to view and contact leads after assembly.